Description
MG Chemicals 4860P-35G, Sn63/Pb37 No Clean Solder Paste ~ 35g (1.23oz) Syringe
4860P Sn63/Pb37 No Clean Solder Paste is made from a blend of high purity, non-recycled tin and lead alloy powder combined with a no-clean flux to form a paste. It is designed for surface mount applications and provides high tack force and good wettability. The post-soldering residues are transparent, nonconductive, non-corrosive, and highly insulated. (“No-clean” means that residues are not harmful to assemblies.)
Applications and Uses
This solder paste is designed for use in high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as 0.3 mm.
Features and Benefits
- Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
- Flux meets J-STD-004B
- Non-corrosive
- Non-conductive residue
- Halide free
- Good wettability
- Type 3 (45-25 µm)